Price: 21.75 - 10.87
PPD CPU Heating Platform For Mobile Phone PCB Motherboard Chip CPU Heating Glue Removal Solder Removal Remove Station
Features:
1.Applicable to 99% of the chips on the market, 20mmX18.5mm work area, support for multi-generation cell phone chips universal hard disk and CPU in addition to the gum in addition to tin
2. Easy to remove tin, heating work, the temperature can be adjusted between 160 ° C ~ 250 ° C, to effectively avoid, because the temperature is too high or improperly adjusted to lead to burned chips
3. No air gun heating, no soldering iron heating.
4. Flexible hidden screw, flexible and lightweight, flexible retractable clamping at the same time hidden screw to eliminate residue falling into the screw, more durable and better to use.
5. Constant temperature heating, wide range of applications, no air gun heating, no soldering iron heating, no tin suction tape, low voltage heating plate, curve heating, full fit design.
Parameter:
Name: Constant temperature heating de-gluing table
Input voltage: 9V
Working area: 20mmX18.5mm
Adjustable temperature range：160℃~250℃
Display mode: screen display
Package includes:
Degumming table*1
